COLLABORATION BETWEEN OEM AND EMS TO COMBAT HEAD ON PILLOWING DEFECTS: PART 1 – AXI CAPABILITY FOR HOP DETECTION
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![Figure 1 from Head-in-Pillow ( HnP ) Defects and Mitigation through Assembly Process Modifications and Control | Semantic Scholar Figure 1 from Head-in-Pillow ( HnP ) Defects and Mitigation through Assembly Process Modifications and Control | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/cee46d59969a0d8de3761748cd3d80b197e1fcfd/2-Figure1-1.png)
Figure 1 from Head-in-Pillow ( HnP ) Defects and Mitigation through Assembly Process Modifications and Control | Semantic Scholar
COLLABORATION BETWEEN OEM AND EMS TO COMBAT HEAD ON PILLOWING DEFECTS: PART 1 – AXI CAPABILITY FOR HOP DETECTION
![Head-in-Pillow Defects 3: Process Issues | | Indium Corporation Blogs | Flux | Head In Pillow | Indium | Indium Corporation | Lead Free Solder | Solder | Solder Flux | Soldering Head-in-Pillow Defects 3: Process Issues | | Indium Corporation Blogs | Flux | Head In Pillow | Indium | Indium Corporation | Lead Free Solder | Solder | Solder Flux | Soldering](https://www.indium.com/blog/media/images/0909/headinpillow_defect_3.jpg)
Head-in-Pillow Defects 3: Process Issues | | Indium Corporation Blogs | Flux | Head In Pillow | Indium | Indium Corporation | Lead Free Solder | Solder | Solder Flux | Soldering
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